Hello,
First would like to thank everyone for their comments and providing the
*.stl files so we all can print a case.
Also have the same concern about possible temp issues, that Vnowinski
has. Heat building up in the case. In terms of reducing the lifespan or
damaging the Tone Board over time.
JohsonChou, take it that you mean that PLA would be ok with any heat
produced by the Tone Board. Or that both the PLA and Tone Board would be
ok with any heat buildup?
If possible can we create a design with some holes. Would prefer the
holes to placed on the side of the case. Something like this:
View attachment 18873View attachment 18874
Or this:
View attachment 18871View attachment 18872
Thank You