- Thread Starter
- #61
i have an off-topic question. when i look at powesoft amps every inch of space is used for large components and i was like - where do they fit all the small stuff ?
well it's on the back of the PCB ...
my question is ... why doesn't everybody do it that way ?
all the chips etc are on the back of PCB in powersoft amps and the front is just for big caps, big chokes, transformers, heatsinks etc ...
why doesn't everybody do things this way ?
they also use heatsinks as chassis for the amplifier modules - so they take an aluminum C channel and build the amplifier module inside of it and use it as a heatsink ...
when i look at powersoft and i look at their "competition" i struggle to understand why the "competition" even exists ?
i mean it won't exist for very long ...
well it's on the back of the PCB ...
my question is ... why doesn't everybody do it that way ?
all the chips etc are on the back of PCB in powersoft amps and the front is just for big caps, big chokes, transformers, heatsinks etc ...
why doesn't everybody do things this way ?
they also use heatsinks as chassis for the amplifier modules - so they take an aluminum C channel and build the amplifier module inside of it and use it as a heatsink ...
when i look at powersoft and i look at their "competition" i struggle to understand why the "competition" even exists ?
i mean it won't exist for very long ...