SOIC should not be a problem
perhaps it could be done more elegantly, but my approach is as follows:
A. Desoldering.
1. Put some flux on pins.
2. Heat all 4 one side pins with T12-K tip (or any other appropriate). Temperature controlled soldering station is a must.
3. With forceps catch the package and very slightly elevate heated side to detach the pins. Opposite pins will bent a little.
4. Heat opposite pins and remove the package.
5. Wick excess of the solder from pads.
B. Soldering.
1. Carefully adjust the package on the pads and fasten it touching 1/5 pin with soldering tip.
2. Take a second look is it OK.
3. Properly solder pins 1-8.
It might be even easier with hot air reworking gun, but I do not like to use it in crowded areas